1. Ukulungiselela I-Substrate: Khetha-ikhwalithi ephezulu ye-FR4 PCB substrate njenge-substrate.
2. Ukwelashwa kwendawo: Ukusika, ukubhola, ukupholisha ngamakhemikhali, njll.
3. Ukuphrinta Okunamathelayo: Phrinta ungqimba olunamathelayo endaweni ye-PCB usebenzisa isikrini sikasilika noma ukuphrinta kwesikrini.
4. Ukufakwa: Faka izingxenye ze-elekthronikhi phezu kwesendlalelo sokunamathela ngokwephethini ye-SMD.
5. Ukwelapha: Sebenzisa isibani se-UV ukuze uvikele ungqimba olunamathelayo kanye nezingxenye ze-elekthronikhi endaweni ye-PCB.
6. I-Surface Coating: Sebenzisa umshini wokufaka isifutho ukuze usebenzise{1}}ungqimba lwe-oxidation endaweni ye-PCB ukuze uvimbele i-oxidation nokugqwala.
